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MD Program Admission Events for Spring 2018

Interdepartmental Doctoral Degree Program for Multi-dimensional Materials Science Leaders (MD program)  will host  Three Information Sessions for April 2018 admission.
All sessions will be held in Japanese, but  your questions in English are always welcome during the sessions.
* MD Program’s  Application Guideline for Spring 2018 enrollment will be available in January 2018.

 Information Sessions for
2018 Spring enrollment
 When   Where 
Session 1 at School of Science campus Fri. Dec. 15, 2017
4:30pm-5:30pm
 Lecture room 204 at Science Complex A, School of Science
Session 2 at School of Engineering campus Fri. Jan. 19, 2018
4:30pm-5:30pm
 Materials Collaborative Research Building,  School of Engineering
Session 3 at MD program Lecture room Fri. Feb. 9, 2018
4:30pm-5:30pm
  MD program Lecture room , Engineering Lab. Complex Bldg 11F, School of Engineering 

◆ The information sessions are designed for:

  • Undergraduate Students who will start master’s program in MD program affiliated departments in April 2018.
  • Graduate students (M1) who enrolled in MD program affiliated department’s master course in April  2017 or October 2017.
    *Please refer to the list of MD program participating departments.

◆ Departments affiliated with the MD program

Graduate Schools  Departments
Arts and Letters Human Studies
 Science Physics, Chemistry, Mathematics, Astronomy
Engineering Metallurgy, Materials Science, Material Processing, Applied Chemistry, Mechanical Systems Engineering, Electronic Engineering, Applied Physics
Information Sciences System Information Sciences
Environmental Studies Environmental Studies for Advanced Society, Frontier Science for Advanced Environment
Pharmaceutical Sciences Molecular Pharmaceutical Science

We look forward to you joining us for these rewarding opportunities.

For further information on the information session, please feel free to contact Student Affairs Section of MD program: md-kyom◎grp.tohoku.ac.jp
(Please change ◎ to @ when sending an email).