MD Program Admission Events for Spring 2017
Interdepartmental Doctoral Degree Program for Multi-dimensional Materials Science Leaders (MD program) will host Three Information Sessions for April 2017 admission.
All sessions will be held in Japanese, but your questions in English are always welcome during the sessions.
* MD Program’s Application Guideline for Spring 2017 enrollement will be available in January 2017.
| Information Sessions for
2017 Spring enrollement
|Session 1 at School of Science campus||Thu. Dec. 15, 2016
|Lecture room 204 at Science Complex A, School of Science|
|Session 2 at School of Engineering campus||Thu. Jan. 19, 2017
|Materials Collaborative Research Building, School of Engineering|
|Session 3 at MD program Lecture room||Fri. Feb. 10, 2017
|MD program Lecture room , Engineering Lab. Complex Bldg 11F, School of Engineering|
◆ The information sessions are designed for:
- Undergraduate Students who will start master’s program in MD program affiliated departments in April 2017.
- Graduate students (M1) who enrolled in MD program affiliated department’s master cource in April 2016 or October 2016.
- Undergraduate students who are interested in MD program for your future plan.
*Please refer to the list of MD program participating departments.
◆ Departments affiliated with the MD program
|Arts and Letters||Human Studies|
|Science||Physics, Chemistry, Mathematics, Astronomy|
|Engineering||Metallurgy, Materials Science, Material Processing, Applied Chemistry, Mechanical Systems Engineering, Electronic Engineering, Applied Physics|
|Information Sciences||System Information Sciences|
|Environmental Studies||Environmental Studies for Advanced Society, Frontier Science for Advanced Environment|
|Pharmaceutical Sciences||Molecular Pharmaceutical Science|
We look forward to you joining us for these rewarding opportunities.
For further information on the information session, please feel free to contact Student Affairs Section of MD program: md-kyom◎grp.tohoku.ac.jp
(Please change ◎ to @ when sending an email).